منابع مشابه
High Reliability of High Power and High Brightness Diode Lasers
We report on continued progress in the development of high power and high brightness single emitter laser diodes from 790 nm to 980 nm for reliable use in industrial and pumping applications. High performance has been demonstrated in nLIGHT’s diode laser technology in this spectral range with corresponding peak electrical-to-optical power conversion efficiency of ~65%. These pumps have been inc...
متن کاملemittance control in high power linacs
چکیده این پایان نامه به بررسی اثر سیم پیچ مغناطیسی و کاوه یِ خوشه گر با بسامد رادیویی بر هاله و بیرونگراییِ باریکه هایِ پیوسته و خوشه ایِ ذرات باردار در شتابدهنده های خطیِ یونی، پروتونی با جریان بالا می پردازد و راه حل هایی برای بهینه نگهداشتن این کمیتها ارایه می دهد. بیرونگرایی یکی از کمیتهای اساسی باریکه هایِ ذرات باردار در شتابدهنده ها است که تاثیر قابل توجهی بر قیمت، هزینه و کاراییِ هر شتابدهند...
High temperature reliability of power module substrates
The thermal cycling reliability of candidate copper and aluminium power substrates has been assessed for use at temperatures exceeding 300°C peak using a combination of thermal cycling, nanoindentation and finite element modelling to understand the relative stresses and evolution of the mechanical properties. The results include the relative cycling lifetimes up to 350°C, demonstrating almost a...
متن کاملHigh Reliability Power MOSFETs for Space Applications
We have developed highly reliable and radiation-hardened power MOSFETs for use in outer space applications in satellites and space stations. The largest difference between these newly developed Rad-Hard Power MOSFETs and general-use MOSFETs is that they have excellent durability against high energy charged particles and ionizing radiation. To provide increased durability, electrical characteris...
متن کاملComponent Level Reliability for High Temperature Power Computing with Sac305 and Alternative High Reliability Solders
This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Topside and Bottom-side of the boards. This data is for boards on the FR4-06 substrate. Isothermal storage at high temperature was used to accelerate the aging of the assembli...
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ژورنال
عنوان ژورنال: IEEE Aerospace and Electronic Systems Magazine
سال: 2021
ISSN: ['0885-8985', '1557-959X']
DOI: https://doi.org/10.1109/maes.2021.3081281